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Yesol Kang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Environmentally Friendly Complex Corrosion Inhibitor Using Potassium Oleate and Poly (Sodium 4-Styrene Sulfonate) in Copper Chemical Mechanical Planarization

Number of pages: 31 Posted: 05 Feb 2025
Taesung Kim, Jongyeong Jeon, Seungjun Oh, Seulki Kim, Yesol Kang, Jinhyoung Lee, Hyunho Kim, Geumji Back and Juyeol Lee
Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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Copper chemical mechanical planarization (Cu CMP), Environmentally friendly inhibitor, Surfactant-polymer complex, potassium oleate, poly (sodium 4-styrene sulfonate)