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Hyunho Kim

Sungkyunkwan University

SCHOLARLY PAPERS

4

DOWNLOADS

204

TOTAL CITATIONS

0

Scholarly Papers (4)

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1.

Environmentally Friendly Complex Corrosion Inhibitor Using Potassium Oleate and Poly (Sodium 4-Styrene Sulfonate) in Copper Chemical Mechanical Planarization

Number of pages: 31 Posted: 05 Feb 2025
Taesung Kim, Jongyeong Jeon, Seungjun Oh, Seulki Kim, Yesol Kang, Jinhyoung Lee, Hyunho Kim, Geumji Back and Juyeol Lee
Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 75 (852,604)

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Copper chemical mechanical planarization (Cu CMP), Environmentally friendly inhibitor, Surfactant-polymer complex, potassium oleate, poly (sodium 4-styrene sulfonate)

2.

Investigation of Cleaning Mechanisms for Particle, Metal Ion, and Organic Contaminations in Amorphous Carbon Post-Cmp Cleaning

Number of pages: 27 Posted: 18 Aug 2025
Ziyang Wang, Pengzhan Liu, Juyong Lee, Hyeonjeong Lee, Hyunho Kim, Hosin Hwang, Yinhao An and Taesung Kim
Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University and Sungkyunkwan University
Downloads 52 (1,063,489)

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Amorphous carbon, Chemical Mechanical Polishing, post-CMP cleaning, CMP contamination, Cleaning mechanism

3.

Effect of Fe-Complex Catalysts on Passivation Layer and Hydroxyl Radical Generation During Tungsten Chemical Mechanical Planarization

Number of pages: 48 Posted: 28 Jan 2025
Hyunho Kim, Gyuyoung Lee, Seunghwan Lee, Pengzhan Liu, Jongyeong Jeon, Ziyang Wang, Chaerin Park, Jaewon Lee, Hosin Hwang, Chulwoo Bae and Taesung Kim
Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN and Sungkyunkwan University
Downloads 48 (1,097,529)

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Tungsten CMP, Fe-complex catalyst, Passivation layer, Hydroxyl radical (*OH), Fenton reaction

4.

Control of Ta/Cu Selectivity in Barrier Chemical Mechanical Planarization Via Surface-Charge-Modified Silica Abrasives

Number of pages: 50 Posted: 18 Aug 2025
Jongyeong Jeon, Hyunho Kim, Dayoung Yu, Junhyeong Jeon, Kieun Kwak, Heonjae Kim, Injoon Heo, Hyeonjeong Lee, Yechan Kim, Junil Cho and Taesung Kim
affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN and Sungkyunkwan University
Downloads 29 (1,345,526)

Abstract:

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Silica surface modification, Selectivity, Electrostatic interaction, Barrier CMP