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Hyeonjeong Lee

Sungkyunkwan University

SCHOLARLY PAPERS

4

DOWNLOADS

223

TOTAL CITATIONS

0

Scholarly Papers (4)

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1.

Selectivity Control with Concurrent Enhancement of Inhibition in Cu/Sio2 Cmp Via Polyvinylpyrrolidone Adsorption

Number of pages: 40 Posted: 08 Feb 2025
Taesung Kim, Hosin Hwang, Seunghwan Lee, Jinhyoung Lee, Ziyang Wang, Dayoung Yu, Hyeonjeong Lee and Hyunho Kim
Sungkyunkwan University, Sungkyunkwan University, affiliation not provided to SSRN, Sungkyunkwan University - Natural Sciences Campus, Sungkyunkwan University, affiliation not provided to SSRN, Sungkyunkwan University and affiliation not provided to SSRN
Downloads 111 (635,507)

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Chemical mechanical planarization, Polyvinylpyrrolidone, Selectivity, Corrosion, Inhibitor

2.

Investigation of Cleaning Mechanisms for Particle, Metal Ion, and Organic Contaminations in Amorphous Carbon Post-Cmp Cleaning

Number of pages: 27 Posted: 18 Aug 2025
Ziyang Wang, Pengzhan Liu, Juyong Lee, Hyeonjeong Lee, Hyunho Kim, Hosin Hwang, Yinhao An and Taesung Kim
Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University, Sungkyunkwan University and Sungkyunkwan University
Downloads 53 (1,063,489)

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Amorphous carbon, Chemical Mechanical Polishing, post-CMP cleaning, CMP contamination, Cleaning mechanism

3.

Investigation on the particle cleaning mechanism of surfactant for amorphous carbon post-CMP cleaning at high pH

Number of pages: 22 Posted: 15 Mar 2026
Minha Kim, Ziyang Wang, Jinhyoung Lee, Hyeonjeong Lee, Yinhao An, Changshou Jin and Taesung Kim
Sungkyunkwan University - Natural Sciences Campus, Sungkyunkwan University, Sungkyunkwan University - Natural Sciences Campus, Sungkyunkwan University, Sungkyunkwan University - Natural Sciences Campus, Sungkyunkwan University - Natural Sciences Campus and Sungkyunkwan University
Downloads 30 (1,372,601)

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Surfactant, Amorphous carbon, Chemical mechanical polishing, Post-CMP cleaning, Particle contamination.

4.

Control of Ta/Cu Selectivity in Barrier Chemical Mechanical Planarization Via Surface-Charge-Modified Silica Abrasives

Number of pages: 50 Posted: 18 Aug 2025
Jongyeong Jeon, Hyunho Kim, Dayoung Yu, Junhyeong Jeon, Kieun Kwak, Heonjae Kim, Injoon Heo, Hyeonjeong Lee, Yechan Kim, Junil Cho and Taesung Kim
affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN and Sungkyunkwan University
Downloads 29 (1,345,526)

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Silica surface modification, Selectivity, Electrostatic interaction, Barrier CMP