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Kieun Kwak

affiliation not provided to SSRN

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Scholarly Papers (1)

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Control of Ta/Cu Selectivity in Barrier Chemical Mechanical Planarization Via Surface-Charge-Modified Silica Abrasives

Number of pages: 50 Posted: 18 Aug 2025
Jongyeong Jeon, Hyunho Kim, Dayoung Yu, Junhyeong Jeon, Kieun Kwak, Heonjae Kim, Injoon Heo, Hyeonjeong Lee, Yechan Kim, Junil Cho and Taesung Kim
affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Sungkyunkwan University, affiliation not provided to SSRN, affiliation not provided to SSRN and Sungkyunkwan University
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Abstract:

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Silica surface modification, Selectivity, Electrostatic interaction, Barrier CMP