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Zhengmiao Fu

Beijing Technology and Business University

No. 11/33, Fucheng Road, Haidian District

Liangxiang

Beijing, 102488

China

  • Beijing Technology and Business University

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Scholarly Papers (1)

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Atomic-scale study on nanoparticle removal mechanism during post-Cu CMP cleaning process using ReaxFF MD

Number of pages: 38 Posted: 04 Sep 2025
Lifei Zhang, Qinyang Zeng, Yating Huang, Dewen Zhao, Yongquan Xiao and Zhengmiao Fu
Tsinghua University, Tsinghua University, Beijing Technology and Business University, Tsinghua University, Beijing Technology and Business University and Beijing Technology and Business University
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Abstract:

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Post-Cu CMP cleaning, Reactive force field molecular dynamics, silica nanoparticle deposition, silica nanoparticle removal.