Keywords: Chemical mechanical planarization, Advanced process control, Distributional reinforcement learning, Soft actor-critic reinforcement learning
Chemical mechanical planarization, Advanced process control, Distributional reinforcement learning, Virtual Metrology；Soft actor-critic reinforcement learning
Post-Cu CMP cleaning, Reactive force field molecular dynamics, silica nanoparticle deposition, silica nanoparticle removal.
thin film transistor, dielectric thickness, solution-based process, spin-coating, surface energy-directed assembly
