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Xiao Wang

Jiangsu Normal University

101 Shanghai Rd

Tongshan

Xuzhou

China

  • Jiangsu Normal University

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Growth Behavior and Reliability of Interfacial Imc for Sn58bi/Cu and Sn58bi-Aln/Cu Solder Joints Applied in Igbt Modules

Number of pages: 24 Posted: 29 Jul 2022
Xi Wang, liang zhang, Xiao Wang, Yong-huan Guo, Lei Sun, Ying-xia Liu, Chen Chen and Xiao Lu
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Changzhou University, affiliation not provided to SSRN, Jiangsu Normal University and Jiangsu Normal University
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Sn58Bi, IMC, AlN nanoparticles, phase field simulation