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Lei Sun

Changzhou University

  • Changzhou University

SCHOLARLY PAPERS

8

DOWNLOADS

249

TOTAL CITATIONS

5

Scholarly Papers (8)

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1.

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Downloads 69 (891,180)

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 18 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 56 (1,027,773)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 11 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 13 (1,579,999)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

2.

Growth Behavior and Reliability of Interfacial Imc for Sn58bi/Cu and Sn58bi-Aln/Cu Solder Joints Applied in Igbt Modules

Number of pages: 24 Posted: 29 Jul 2022
Xi Wang, liang zhang, Xiao Wang, Yong-huan Guo, Lei Sun, Ying-xia Liu, Chen Chen and Xiao Lu
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Changzhou University, affiliation not provided to SSRN, Jiangsu Normal University and Jiangsu Normal University
Downloads 41 (1,170,409)
Citation 5

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Sn58Bi, IMC, AlN nanoparticles, phase field simulation

3.

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Downloads 35 (1,277,121)

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 22 Posted: 03 Jun 2025
Mo Chen, Liang Zhang, Chuan Jiang Wu, Qi-ming Chen, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 28 (1,400,723)

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LMP solder, HEAs, soldering, microstructure, mechanical properties

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 23 Posted: 19 Jul 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 7 (1,635,165)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

4.

Investigating the Impact of Cobalt Incorporation on the Transformation of Cu6sn5 Layer to (Cu, Co)6sn5: Microstructural and Mechanical Insights

Number of pages: 25 Posted: 26 Mar 2024
xi huang, Liang Zhang, Kai Deng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 30 (1,332,057)

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Co particles, Sn58Bi solder, IMC, microalloying, mechanical properties

5.

Interfacial Reaction and Strengthening Mechanism of Thermo-Compression Bonding Foam Ni Reinforced Sac105 and Sac105-0.3ti Solder Joints

Number of pages: 21 Posted: 07 May 2024
Chuan Jiang Wu, Liang Zhang, Lei Sun, Peipei Huang and Xing-yu Guo
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Xiamen University of Technology and Xiamen University of Technology
Downloads 27 (1,359,097)

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SAC105, Ti NPs, Foam Ni, Thermo-compression bonding

6.

Interfacial Reaction of Cu/Sac105/Cu Solder Joints Reinforced with Ti Nanoparticles Under Vacuum Thermo-Compression Bonding

Number of pages: 20 Posted: 19 Dec 2023
Chuan Jiang Wu, Liang Zhang, Lei Sun, Xiao Lu and Chen Chen
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Jiangsu Normal University and Jiangsu Normal University
Downloads 18 (1,481,165)

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SAC105, Thermo-compression bonding, Shear strength

7.

The Microstructure and Mechanical Properties of Tlp Bonding with (Snbiinzn)100- X Ga X High Entropy Alloys

Number of pages: 18 Posted: 27 Jun 2025
Mo Chen, Liang Zhang, Yu-Hao Chen and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 15 (1,500,778)

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TLP bonding, HEAs, shear strength, Microstructure, low-temperature solder joints

8.

Composition design and properties of low melting point (SnBiInZn)100- x Ga x high entropy alloy for electronic packaging

Number of pages: 23 Posted: 02 Sep 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 14 (1,509,872)

Abstract:

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties