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Peipei Huang

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

3

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75

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0

Scholarly Papers (3)

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1.

The Effect of Ga on Interfacial Reactions and Intermetallic Evolution in Snbigain Quaternary Alloys

Number of pages: 27 Posted: 13 Jun 2025
Chuan Jiang Wu, Peipei Huang, liang zhang, Xing-yu Guo, Mo Chen, N. Jang, Hyoung Seop Kim and Yu-Hao Chen
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 33 (1,372,601)

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SnBi-based solder, Gallium addition, Cu9Ga4 intermetallic compound, Interfacial reaction, Mechanical reliability, Microstructure evolution

2.

Interfacial Reaction and Strengthening Mechanism of Thermo-Compression Bonding Foam Ni Reinforced Sac105 and Sac105-0.3ti Solder Joints

Number of pages: 21 Posted: 07 May 2024
Chuan Jiang Wu, Liang Zhang, Lei Sun, Peipei Huang and Xing-yu Guo
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Xiamen University of Technology and Xiamen University of Technology
Downloads 27 (1,359,097)

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SAC105, Ti NPs, Foam Ni, Thermo-compression bonding

3.

Effect of Si3n4 Nanoparticles on Imc as Well as Mechanical Properties of Sn58bi/Cu Solder Joints During Thermal Aging

Number of pages: 10 Posted: 02 Apr 2024
Kai Deng, Liang Zhang, Mo Chen and Peipei Huang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 15 (1,500,778)

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intermetallic compounds, thermal aging, Mechanical properties, Sn58Bi solder, Si3N4 nanoparticles