Author Page for Kai Deng

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

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Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 07 Nov 2023

Xiao Lu, liang zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan Jiang Wu, xi huang and Kai Deng

Jiangsu Normal University, Jiangsu Normal University, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology

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Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 17 Nov 2023

Xiao Lu, Liang Zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan-Jiang Wu, xi huang and Kai Deng

Jiangsu Normal University, Xiamen University of Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen Institute of Technology, Xiamen University of Technology and Xiamen University of Technology

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Investigating the Impact of Cobalt Incorporation on the Transformation of Cu6sn5 Layer to (Cu, Co)6sn5: Microstructural and Mechanical Insights

Number of pages: 25 Posted: 26 Mar 2024

xi huang, Liang Zhang, Kai Deng and Lei Sun

Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University

Downloads 30 (1,332,057)

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3.

Effect of Si3n4 Nanoparticles on Imc as Well as Mechanical Properties of Sn58bi/Cu Solder Joints During Thermal Aging

Number of pages: 10 Posted: 02 Apr 2024

Kai Deng, Liang Zhang, Mo Chen and Peipei Huang

Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology

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Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Number of pages: 21 Posted: 24 Oct 2023

Chuan Jiang Wu, Liang Zhang, Chen Chen, Xiao Lu, Kai Deng and xi huang

Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Xiamen University of Technology and Xiamen University of Technology

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Kai Deng

Xiamen University of Technology

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Scholarly Papers (4)

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Abstract:

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Abstract:

Investigating the Impact of Cobalt Incorporation on the Transformation of Cu6sn5 Layer to (Cu, Co)6sn5: Microstructural and Mechanical Insights

Abstract:

Effect of Si3n4 Nanoparticles on Imc as Well as Mechanical Properties of Sn58bi/Cu Solder Joints During Thermal Aging

Abstract:

Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Abstract: