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Chuan-Jiang Wu
Xiamen Institute of Technology
Xiamen
China
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Xiamen Institute of Technology
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SCHOLARLY PAPERS
1
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25
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Scholarly Papers (1)
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1.
Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering
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(907,769)
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1
Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering
Number of pages: 14
Posted: 17 Nov 2023
Xiao Lu
,
Liang Zhang
,
Zhi-Quan Liu
,
Li-Yin Gao
,
Chen Chen
, Chuan-Jiang Wu,
xi huang
and
Kai Deng
Jiangsu Normal University, Xiamen University of Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen Institute of Technology, Xiamen University of Technology and Xiamen University of Technology
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Abstract:
(111) nt-Cu, Vacuum soldering, Reliability, EBSD
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