Author Page for Xiao Lu

Orthogonal Design Optimization for Cu/Sn58bi-0.4mg/Cu Solder Joint Strength in Ultrasonic-Assisted Soldering

Number of pages: 16 Posted: 20 Oct 2023

xi huang, liang zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun

Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University

Downloads 38 (938,128)

Abstract:

2.

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Downloads 33 (988,665)

Citation 3

2

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 07 Nov 2023

Xiao Lu, liang zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan Jiang Wu, xi huang and Kai Deng

Jiangsu Normal University, Jiangsu Normal University, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology

Downloads 18 (1,204,769)

Abstract:

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 17 Nov 2023

Xiao Lu, Liang Zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan-Jiang Wu, xi huang and Kai Deng

Jiangsu Normal University, Xiamen University of Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen Institute of Technology, Xiamen University of Technology and Xiamen University of Technology

Downloads 15 (1,245,823)

Citation 3

Abstract:

3.

Interfacial Structures and Mechanical Properties of Cu/Sn/Cu Containing Sic Nanowires Under Transient Liquid Phase Bonding

Number of pages: 14 Posted: 07 May 2022

Mu-lan Li, liang zhang, Li-li Gao, Xi Wang, Chen Chen and Xiao Lu

Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University

Downloads 33 (988,665)

Citation 8

Abstract:

4.

Growth Behavior and Reliability of Interfacial Imc for Sn58bi/Cu and Sn58bi-Aln/Cu Solder Joints Applied in Igbt Modules

Number of pages: 24 Posted: 29 Jul 2022

Xi Wang, liang zhang, Xiao Wang, Yong-huan Guo, Lei Sun, Ying-xia Liu, Chen Chen and Xiao Lu

Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Changzhou University, affiliation not provided to SSRN, Jiangsu Normal University and Jiangsu Normal University

Downloads 32 (999,314)

Citation 5

Abstract:

5.

Thermal, Microstructural, Wettability and Mechanical Properties of Sn1.0ag0.5cu Composite Solder Modified with Ti Nanoparticles

Number of pages: 19 Posted: 16 Jan 2024

Chuan Jiang Wu, Liang Zhang, Chen Chen and Xiao Lu

Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University and Jiangsu Normal University

Downloads 24 (1,091,631)

Abstract:

6.

Intermetallic Compound Growth Behavior and Mechanical Performance in Sn58bi/Cu Solder Joint Bearing Mg Particles Incorporation During Thermal Aging

Number of pages: 22 Posted: 01 Dec 2023

xi huang, Liang Zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun

Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University

Downloads 23 (1,104,076)

Citation 1

Abstract:

7.

Effect of Aln on the Microstructure Evolution of Cu/Sn58bi/Cu Solder Joints for 3d Packaging at Different Bonding Timeseffect of Aln on the Microstructure Evolution of Cu/Sn58bi/Cu Solder Joints for 3d Packaging at Different Bonding Times

Number of pages: 11 Posted: 29 May 2023

Xi Wang, liang zhang, Chen Chen and Xiao Lu

Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University

Downloads 18 (1,166,722)

Abstract:

8.

Microstructure Evolution and Thermal, Wetting, Mechanical Properties of Sic Nanowires Reinforced Sac105 Composite Solder

Number of pages: 18 Posted: 19 Nov 2022

Xiao Lu, Liang Zhang, Yong-huan Guo, Xi Wang, Li-li Gao, Li-Li Gao, Meng Zhao and Chen Chen

Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN and Jiangsu Normal University

Downloads 13 (1,227,824)

Abstract:

9.

Interfacial Reaction of Cu/Sac105/Cu Solder Joints Reinforced with Ti Nanoparticles Under Vacuum Thermo-Compression Bonding

Number of pages: 20 Posted: 19 Dec 2023

Chuan Jiang Wu, Liang Zhang, Lei Sun, Xiao Lu and Chen Chen

Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Jiangsu Normal University and Jiangsu Normal University

Downloads 12 (1,239,071)

Abstract:

10.

Effect of Si3n4 Nanowires on the Interfacial Evolution and Mechanical Properties of the Cu/Sac105/Cu Solder Joint by Transient Liquid Phase Bonding

Number of pages: 15 Posted: 15 May 2023

Xiao Lu, liang zhang, Chen Chen and Xi Wang

Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University

Downloads 11 (1,249,787)

Abstract:

11.

Study on the Interfacial Evolution and Mechanical Properties of the Cu/Sac105/Cu Solder Joint Modified by Si3n4 Nanowires

Number of pages: 15 Posted: 25 May 2023

Xiao Lu, Liang Zhang, Chen Chen and Xi Wang

Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University and Jiangsu Normal University

Downloads 9 (1,269,296)

Abstract:

12.

Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Number of pages: 21 Posted: 24 Oct 2023

Chuan Jiang Wu, Liang Zhang, Chen Chen, Xiao Lu, Kai Deng and xi huang

Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Xiamen University of Technology and Xiamen University of Technology

Downloads 8 (1,277,776)

Citation 3

Abstract:

13.

Comprehensive Analysis of Sn58bi/Cu Solder Joints Reinforced with Mg Particles: Wettability, Thermal, Mechanics, and Microstructural Characterization

Number of pages: 20 Posted: 09 Aug 2023

xi huang, liang zhang, Chen Chen, Xiao Lu and Xi Wang

Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University

Downloads 8 (1,277,776)

Citation 2

Abstract:

14.

Microstructure and Orientation Evolution of Β-Sn and Interfacial Cu6sn5 Imc Grains in Sac105 Solder Joints Modified by Si3n4 Nanowires

Number of pages: 19 Posted: 19 Jul 2023

Xiao Lu, liang zhang, Chen Chen and Xi Wang

Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University

Downloads 7 (1,285,453)

Xiao Lu

Jiangsu Normal University

14

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Scholarly Papers (14)

Orthogonal Design Optimization for Cu/Sn58bi-0.4mg/Cu Solder Joint Strength in Ultrasonic-Assisted Soldering

Abstract:

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Abstract:

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Abstract:

Interfacial Structures and Mechanical Properties of Cu/Sn/Cu Containing Sic Nanowires Under Transient Liquid Phase Bonding

Abstract:

Growth Behavior and Reliability of Interfacial Imc for Sn58bi/Cu and Sn58bi-Aln/Cu Solder Joints Applied in Igbt Modules

Abstract:

Thermal, Microstructural, Wettability and Mechanical Properties of Sn1.0ag0.5cu Composite Solder Modified with Ti Nanoparticles

Abstract:

Intermetallic Compound Growth Behavior and Mechanical Performance in Sn58bi/Cu Solder Joint Bearing Mg Particles Incorporation During Thermal Aging

Abstract:

Effect of Aln on the Microstructure Evolution of Cu/Sn58bi/Cu Solder Joints for 3d Packaging at Different Bonding Timeseffect of Aln on the Microstructure Evolution of Cu/Sn58bi/Cu Solder Joints for 3d Packaging at Different Bonding Times

Abstract:

Microstructure Evolution and Thermal, Wetting, Mechanical Properties of Sic Nanowires Reinforced Sac105 Composite Solder

Abstract:

Interfacial Reaction of Cu/Sac105/Cu Solder Joints Reinforced with Ti Nanoparticles Under Vacuum Thermo-Compression Bonding

Abstract:

Effect of Si3n4 Nanowires on the Interfacial Evolution and Mechanical Properties of the Cu/Sac105/Cu Solder Joint by Transient Liquid Phase Bonding

Abstract:

Study on the Interfacial Evolution and Mechanical Properties of the Cu/Sac105/Cu Solder Joint Modified by Si3n4 Nanowires

Abstract:

Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Abstract:

Comprehensive Analysis of Sn58bi/Cu Solder Joints Reinforced with Mg Particles: Wettability, Thermal, Mechanics, and Microstructural Characterization

Abstract:

Microstructure and Orientation Evolution of Β-Sn and Interfacial Cu6sn5 Imc Grains in Sac105 Solder Joints Modified by Si3n4 Nanowires

Abstract: