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lei Sun

Changzhou University

  • Changzhou University

SCHOLARLY PAPERS

2

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113

TOTAL CITATIONS

1

Scholarly Papers (2)

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1.

Orthogonal Design Optimization for Cu/Sn58bi-0.4mg/Cu Solder Joint Strength in Ultrasonic-Assisted Soldering

Number of pages: 16 Posted: 20 Oct 2023
xi huang, liang zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University
Downloads 72 (860,052)

Abstract:

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ultrasonic-assisted soldering, Sn58Bi solder, Mg particles, orthogonal experiment, ANOVA.

2.

Intermetallic Compound Growth Behavior and Mechanical Performance in Sn58bi/Cu Solder Joint Bearing Mg Particles Incorporation During Thermal Aging

Number of pages: 22 Posted: 01 Dec 2023
xi huang, Liang Zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University
Downloads 41 (1,170,409)
Citation 1

Abstract:

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IMC growth, Sn58Bi solder, Mg particles, thermal aging, mechanical properties.