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xi huang

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

7

DOWNLOADS

280

TOTAL CITATIONS

11

Scholarly Papers (7)

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1.

Orthogonal Design Optimization for Cu/Sn58bi-0.4mg/Cu Solder Joint Strength in Ultrasonic-Assisted Soldering

Number of pages: 16 Posted: 20 Oct 2023
xi huang, liang zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University
Downloads 72 (860,052)

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ultrasonic-assisted soldering, Sn58Bi solder, Mg particles, orthogonal experiment, ANOVA.

2.

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Downloads 66 (907,769)
Citation 3

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 07 Nov 2023
Xiao Lu, liang zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan Jiang Wu, xi huang and Kai Deng
Jiangsu Normal University, Jiangsu Normal University, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 41 (1,196,631)

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(111) nt-Cu, Vacuum soldering, Reliability, EBSD

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 17 Nov 2023
Xiao Lu, Liang Zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan-Jiang Wu, xi huang and Kai Deng
Jiangsu Normal University, Xiamen University of Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen Institute of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 25 (1,430,393)
Citation 3

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(111) nt-Cu, Vacuum soldering, Reliability, EBSD

3.

The effect of ultrasonic-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-0.3Co/Cu solder joints

Number of pages: 22 Posted: 20 Nov 2025
min jia Zhang, xi huang, Liang Zhang, Yu-Hao Chen and Hui Wang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and affiliation not provided to SSRN
Downloads 41 (1,196,171)

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Ultrasonic-assisted soldering, ultrasonic soldering time, Microstructure, grain orientation, Mechanical Properties

4.

Intermetallic Compound Growth Behavior and Mechanical Performance in Sn58bi/Cu Solder Joint Bearing Mg Particles Incorporation During Thermal Aging

Number of pages: 22 Posted: 01 Dec 2023
xi huang, Liang Zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University
Downloads 41 (1,170,409)
Citation 1

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IMC growth, Sn58Bi solder, Mg particles, thermal aging, mechanical properties.

5.

Investigating the Impact of Cobalt Incorporation on the Transformation of Cu6sn5 Layer to (Cu, Co)6sn5: Microstructural and Mechanical Insights

Number of pages: 25 Posted: 26 Mar 2024
xi huang, Liang Zhang, Kai Deng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 30 (1,332,057)

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Co particles, Sn58Bi solder, IMC, microalloying, mechanical properties

6.

Comprehensive Analysis of Sn58bi/Cu Solder Joints Reinforced with Mg Particles:  Wettability, Thermal, Mechanics, and Microstructural Characterization

Number of pages: 20 Posted: 09 Aug 2023
xi huang, liang zhang, Chen Chen, Xiao Lu and Xi Wang
Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University
Downloads 17 (1,481,165)
Citation 4

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wettability, thermal properties, microstructure, interfacial IMC, mechanical properties

7.

Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Number of pages: 21 Posted: 24 Oct 2023
Chuan Jiang Wu, Liang Zhang, Chen Chen, Xiao Lu, Kai Deng and xi huang
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Xiamen University of Technology and Xiamen University of Technology
Downloads 13 (1,518,554)
Citation 3

Abstract:

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Vacuum soldering, Mechanical properties, Fracture path, Agglomeration