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Hui Wang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

5

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104

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0

Scholarly Papers (5)

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1.

The effect of ultrasonic-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-0.3Co/Cu solder joints

Number of pages: 22 Posted: 20 Nov 2025
min jia Zhang, xi huang, Liang Zhang, Yu-Hao Chen and Hui Wang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and affiliation not provided to SSRN
Downloads 41 (1,196,171)

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Ultrasonic-assisted soldering, ultrasonic soldering time, Microstructure, grain orientation, Mechanical Properties

2.

Effect of ultrasound-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-Foam Co/Cu soldered joints: Experiments and first-principles calculations

Number of pages: 34 Posted: 25 Nov 2025
min jia Zhang, Liang Zhang, Yu-Hao Chen and Hui Wang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and affiliation not provided to SSRN
Downloads 40 (1,183,237)

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Foam Co, Ultrasonic power and time, Microstructure, Mechanical properties, First-principles calculations

3.

Effect of Ga addition on interfacial reactions and intermetallic evolution in low-melting-point In-34Bi-15Sn solder alloys on Cu substrates

Number of pages: 20 Posted: 27 Dec 2025
Xiao-bin Zhang, Liang Zhang, Yu-Hao Chen, Hui Wang, min jia Zhang and Xing-yu Guo
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, affiliation not provided to SSRN, Xiamen University of Technology and Xiamen University of Technology
Downloads 18 (1,481,165)

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Ga element, Quaternary low-melting-point alloy solder, Wetting properties, Mechanical Properties, IMC

4.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder jointsStatic magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 02 Jun 2026
Xiao-bin Zhang, liang zhang, Yu-Hao Chen, Hui Wang and Xin-nian Chen
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 5 (1,584,314)

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Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC

5.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 24 Jun 2026
Xiao-bin Zhang, liang zhang, Yu-Hao Chen, Hui Wang and Xin-nian Chen
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 0

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Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC