default author photo

Xiao-bin Zhang

Xiamen University of Technology

Xiamen

China

SCHOLARLY PAPERS

3

DOWNLOADS

23

TOTAL CITATIONS

0

Scholarly Papers (3)

1.

Effect of Ga addition on interfacial reactions and intermetallic evolution in low-melting-point In-34Bi-15Sn solder alloys on Cu substrates

Number of pages: 20 Posted: 27 Dec 2025
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, affiliation not provided to SSRN, Xiamen University of Technology and Xiamen University of Technology
Downloads 18 (1,481,165)

Abstract:

Loading...

Ga element, Quaternary low-melting-point alloy solder, Wetting properties, Mechanical Properties, IMC

2.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder jointsStatic magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 02 Jun 2026
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 5 (1,584,314)

Abstract:

Loading...

Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC

3.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 24 Jun 2026
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 0

Abstract:

Loading...

Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC