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Xin-nian Chen

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

4

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23

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0

Scholarly Papers (4)

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1.

Effect of ultrasonic Ni-sprayed Cu substrates on the microstructures and properties of composite interconnection joints

Number of pages: 19 Posted: 13 Feb 2026
Yun-xin Liu, Cheng Chen, Liang Zhang, Yu-Hao Chen, min jia Zhang, Xin-nian Chen and lei shi
Xiamen University of Technology, affiliation not provided to SSRN, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Zhejiang University of Technology
Downloads 10 (1,548,648)

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Ni-sprayed, microstructural, mechanical properties, Shear Strength

2.

Bi-content-dependent interfacial transition and mechanical response of Sn-Bi/Cu solder joints modified by a Ga-In-Sn additive

Number of pages: 21 Posted: 27 Apr 2026
Qi-ming Chen, Liang Zhang, Xin-nian Chen, N. Jang, Hyoung Seop Kim and Yu-Hao Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 8 (1,561,096)

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Sn-Bi solder, Ga-In-Sn additive, interfacial intermetallic compound, shear strength

3.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder jointsStatic magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 02 Jun 2026
Xiao-bin Zhang, liang zhang, Yu-Hao Chen, Hui Wang and Xin-nian Chen
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 5 (1,584,314)

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Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC

4.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 24 Jun 2026
Xiao-bin Zhang, liang zhang, Yu-Hao Chen, Hui Wang and Xin-nian Chen
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
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Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC