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Qi-ming Chen

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

5

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76

TOTAL CITATIONS

0

Scholarly Papers (5)

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1.

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Downloads 35 (1,277,121)

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 22 Posted: 03 Jun 2025
Mo Chen, Liang Zhang, Chuan Jiang Wu, Qi-ming Chen, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 28 (1,400,723)

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LMP solder, HEAs, soldering, microstructure, mechanical properties

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 23 Posted: 19 Jul 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 7 (1,635,165)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

2.

Effects of Bi content on melting characteristics, microstructure, and shear strength of Sn-based solders

Number of pages: 18 Posted: 28 Oct 2025
Qi-ming Chen, Liang Zhang, Yu-Hao Chen, lei shi, min jia Zhang and Mo Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhejiang University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 16 (1,500,778)

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Sn-Bi solder, Wettability, IMC layer, Shearing strength

3.

Composition design and properties of low melting point (SnBiInZn)100- x Ga x high entropy alloy for electronic packaging

Number of pages: 23 Posted: 02 Sep 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 14 (1,509,872)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

4.

Bi-content-dependent interfacial transition and mechanical response of Sn-Bi/Cu solder joints modified by a Ga-In-Sn additive

Number of pages: 21 Posted: 27 Apr 2026
Qi-ming Chen, Liang Zhang, Xin-nian Chen, N. Jang, Hyoung Seop Kim and Yu-Hao Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 8 (1,561,096)

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Sn-Bi solder, Ga-In-Sn additive, interfacial intermetallic compound, shear strength

5.

Si3N4@CuO core-shell nanoparticles induce interfacial IMC refinement and mechanical properties enhancement of Sn58Bi solder joints

Number of pages: 21 Posted: 16 Jun 2026
Qi-ming Chen, Liang Zhang, Yu-Hao Chen and lei shi
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Zhejiang University of Technology
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