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Si-yuan Peng

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

2

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49

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Scholarly Papers (2)

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1.

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Downloads 35 (1,277,121)

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 22 Posted: 03 Jun 2025
Mo Chen, Liang Zhang, Chuan Jiang Wu, Qi-ming Chen, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 28 (1,400,723)

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LMP solder, HEAs, soldering, microstructure, mechanical properties

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 23 Posted: 19 Jul 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 7 (1,635,165)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

2.

Composition design and properties of low melting point (SnBiInZn)100- x Ga x high entropy alloy for electronic packaging

Number of pages: 23 Posted: 02 Sep 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 14 (1,509,872)

Abstract:

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties