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Chuan Jiang Wu

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

10

DOWNLOADS

275

TOTAL CITATIONS

3

Scholarly Papers (10)

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1.

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Downloads 41 (907,769)

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 07 Nov 2023
Xiao Lu, liang zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan Jiang Wu, xi huang and Kai Deng
Jiangsu Normal University, Jiangsu Normal University, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 41 (1,196,631)

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(111) nt-Cu, Vacuum soldering, Reliability, EBSD

2.

Thermal, Microstructural, Wettability and Mechanical Properties of Sn1.0ag0.5cu Composite Solder Modified with Ti Nanoparticles

Number of pages: 19 Posted: 16 Jan 2024
Chuan Jiang Wu, Liang Zhang, Chen Chen and Xiao Lu
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University and Jiangsu Normal University
Downloads 49 (1,074,648)

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SAC105, Ti NPs, CTE, EPMA

3.

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Downloads 35 (1,277,121)

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 22 Posted: 03 Jun 2025
Mo Chen, Liang Zhang, Chuan Jiang Wu, Qi-ming Chen, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 28 (1,400,723)

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LMP solder, HEAs, soldering, microstructure, mechanical properties

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 23 Posted: 19 Jul 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 7 (1,635,165)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

4.

The Effect of Ga on Interfacial Reactions and Intermetallic Evolution in Snbigain Quaternary Alloys

Number of pages: 27 Posted: 13 Jun 2025
Chuan Jiang Wu, Peipei Huang, liang zhang, Xing-yu Guo, Mo Chen, N. Jang, Hyoung Seop Kim and Yu-Hao Chen
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 33 (1,372,601)

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SnBi-based solder, Gallium addition, Cu9Ga4 intermetallic compound, Interfacial reaction, Mechanical reliability, Microstructure evolution

5.

Interfacial Reaction and Strengthening Mechanism of Thermo-Compression Bonding Foam Ni Reinforced Sac105 and Sac105-0.3ti Solder Joints

Number of pages: 21 Posted: 07 May 2024
Chuan Jiang Wu, Liang Zhang, Lei Sun, Peipei Huang and Xing-yu Guo
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Xiamen University of Technology and Xiamen University of Technology
Downloads 27 (1,359,097)

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SAC105, Ti NPs, Foam Ni, Thermo-compression bonding

6.

Magnetic Field Accelerates Precipitation Kinetics of Magnetic Sn58bi-Ni Solder to Enhance the Strength of Solder Joint

Number of pages: 22 Posted: 27 Mar 2025
Liang Zhang, Chuan Jiang Wu, Yu-Hao Chen, Xin-Quan Yu, Quan-Bin Lu and Weimin Long
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and affiliation not provided to SSRN
Downloads 23 (1,411,822)

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magnetic solder, magnetic field, precipitation kinetics, first-principles

7.

Shear Properties of Low-Temperature Soldered Joints of Aluminum Nitride Metallized with Sn-1.0ag-0.5cu-Ti Alloys

Number of pages: 20 Posted: 16 Oct 2024
Chuan Jiang Wu, Liang Zhang, Si-yong Gu, N. Jang, Hyoung Seop Kim and yu-ao Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 22 (1,436,435)

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Wettability, Pre-metallization, AlN, Interfacial microstructure, Shear strength

8.

Interfacial Reaction of Cu/Sac105/Cu Solder Joints Reinforced with Ti Nanoparticles Under Vacuum Thermo-Compression Bonding

Number of pages: 20 Posted: 19 Dec 2023
Chuan Jiang Wu, Liang Zhang, Lei Sun, Xiao Lu and Chen Chen
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Jiangsu Normal University and Jiangsu Normal University
Downloads 18 (1,481,165)

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SAC105, Thermo-compression bonding, Shear strength

9.

Composition design and properties of low melting point (SnBiInZn)100- x Ga x high entropy alloy for electronic packaging

Number of pages: 23 Posted: 02 Sep 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 14 (1,509,872)

Abstract:

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

10.

Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Number of pages: 21 Posted: 24 Oct 2023
Chuan Jiang Wu, Liang Zhang, Chen Chen, Xiao Lu, Kai Deng and xi huang
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Xiamen University of Technology and Xiamen University of Technology
Downloads 13 (1,518,554)
Citation 3

Abstract:

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Vacuum soldering, Mechanical properties, Fracture path, Agglomeration