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Yu-Hao Chen

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

17

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392

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0

Scholarly Papers (17)

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1.

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Downloads 69 (891,180)

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 18 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 56 (1,027,773)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 11 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 13 (1,579,999)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

2.

The effect of ultrasonic-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-0.3Co/Cu solder joints

Number of pages: 22 Posted: 20 Nov 2025
min jia Zhang, xi huang, Liang Zhang, Yu-Hao Chen and Hui Wang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and affiliation not provided to SSRN
Downloads 41 (1,196,171)

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Ultrasonic-assisted soldering, ultrasonic soldering time, Microstructure, grain orientation, Mechanical Properties

3.

Effect of ultrasound-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-Foam Co/Cu soldered joints: Experiments and first-principles calculations

Number of pages: 34 Posted: 25 Nov 2025
min jia Zhang, Liang Zhang, Yu-Hao Chen and Hui Wang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and affiliation not provided to SSRN
Downloads 40 (1,183,237)

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Foam Co, Ultrasonic power and time, Microstructure, Mechanical properties, First-principles calculations

4.

The effect of ultrasonic processing on the microstructure and mechanical properties of (SnBiInZn)99.5Ga0.5 high entropy alloy/Cu solder joint

Number of pages: 20 Posted: 11 Oct 2025
Mo Chen, liang zhang, Yu-Hao Chen and lei shi
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology and Zhejiang University of Technology
Downloads 36 (1,249,711)

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high entropy alloys, solder joints, Microstructure, shear strength

5.

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Downloads 35 (1,277,121)

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 22 Posted: 03 Jun 2025
Mo Chen, Liang Zhang, Chuan Jiang Wu, Qi-ming Chen, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 28 (1,400,723)

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LMP solder, HEAs, soldering, microstructure, mechanical properties

Composition Design and Properties of Low Melting Point (Snbiinzn)100- X Ga X High Entropy Alloy for Electronic Packaging

Number of pages: 23 Posted: 19 Jul 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 7 (1,635,165)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

6.

The Effect of Ga on Interfacial Reactions and Intermetallic Evolution in Snbigain Quaternary Alloys

Number of pages: 27 Posted: 13 Jun 2025
Chuan Jiang Wu, Peipei Huang, liang zhang, Xing-yu Guo, Mo Chen, N. Jang, Hyoung Seop Kim and Yu-Hao Chen
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 33 (1,372,601)

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SnBi-based solder, Gallium addition, Cu9Ga4 intermetallic compound, Interfacial reaction, Mechanical reliability, Microstructure evolution

7.

Interstitial Nitrogen-Driven Surface Reconstruction in Feconi Coatings for Enhanced Oer Activity and Durability

Number of pages: 30 Posted: 13 Aug 2025
Yu-Hao Chen, Jiang Xu, Liang Zhang, Minming Jiang, Zonghan Xie and Paul Munroe
Xiamen University of Technology, Nanjing University of Aeronautics and Astronautics, Xiamen University of Technology, Xiamen University of Technology, University of Adelaide and University of New South Wales (UNSW)
Downloads 26 (1,399,036)

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FeCoNi coating, transition metal interstitial nitrides, surface reconstruction, oxygen evolution reaction, catalytic performance

8.

Magnetic Field Accelerates Precipitation Kinetics of Magnetic Sn58bi-Ni Solder to Enhance the Strength of Solder Joint

Number of pages: 22 Posted: 27 Mar 2025
Liang Zhang, Chuan Jiang Wu, Yu-Hao Chen, Xin-Quan Yu, Quan-Bin Lu and Weimin Long
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and affiliation not provided to SSRN
Downloads 23 (1,411,822)

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magnetic solder, magnetic field, precipitation kinetics, first-principles

9.

Effect of Ga addition on interfacial reactions and intermetallic evolution in low-melting-point In-34Bi-15Sn solder alloys on Cu substrates

Number of pages: 20 Posted: 27 Dec 2025
Xiao-bin Zhang, Liang Zhang, Yu-Hao Chen, Hui Wang, min jia Zhang and Xing-yu Guo
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, affiliation not provided to SSRN, Xiamen University of Technology and Xiamen University of Technology
Downloads 18 (1,481,165)

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Ga element, Quaternary low-melting-point alloy solder, Wetting properties, Mechanical Properties, IMC

10.

Effects of Bi content on melting characteristics, microstructure, and shear strength of Sn-based solders

Number of pages: 18 Posted: 28 Oct 2025
Qi-ming Chen, Liang Zhang, Yu-Hao Chen, lei shi, min jia Zhang and Mo Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhejiang University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 16 (1,500,778)

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Sn-Bi solder, Wettability, IMC layer, Shearing strength

11.

The Microstructure and Mechanical Properties of Tlp Bonding with (Snbiinzn)100- X Ga X High Entropy Alloys

Number of pages: 18 Posted: 27 Jun 2025
Mo Chen, Liang Zhang, Yu-Hao Chen and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 15 (1,500,778)

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TLP bonding, HEAs, shear strength, Microstructure, low-temperature solder joints

12.

Composition design and properties of low melting point (SnBiInZn)100- x Ga x high entropy alloy for electronic packaging

Number of pages: 23 Posted: 02 Sep 2025
Mo Chen, Liang Zhang, Qi-ming Chen, Chuan Jiang Wu, Yu-Hao Chen, Si-yuan Peng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 14 (1,509,872)

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LMP solder, HEAs, soldering, Microstructure, Mechanical properties

13.

Effect of ultrasonic Ni-sprayed Cu substrates on the microstructures and properties of composite interconnection joints

Number of pages: 19 Posted: 13 Feb 2026
Yun-xin Liu, Cheng Chen, Liang Zhang, Yu-Hao Chen, min jia Zhang, Xin-nian Chen and lei shi
Xiamen University of Technology, affiliation not provided to SSRN, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Zhejiang University of Technology
Downloads 10 (1,548,648)

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Ni-sprayed, microstructural, mechanical properties, Shear Strength

14.

Bi-content-dependent interfacial transition and mechanical response of Sn-Bi/Cu solder joints modified by a Ga-In-Sn additive

Number of pages: 21 Posted: 27 Apr 2026
Qi-ming Chen, Liang Zhang, Xin-nian Chen, N. Jang, Hyoung Seop Kim and Yu-Hao Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 8 (1,561,096)

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Sn-Bi solder, Ga-In-Sn additive, interfacial intermetallic compound, shear strength

15.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder jointsStatic magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 02 Jun 2026
Xiao-bin Zhang, liang zhang, Yu-Hao Chen, Hui Wang and Xin-nian Chen
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 5 (1,584,314)

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Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC

16.

Si3N4@CuO core-shell nanoparticles induce interfacial IMC refinement and mechanical properties enhancement of Sn58Bi solder joints

Number of pages: 21 Posted: 16 Jun 2026
Qi-ming Chen, Liang Zhang, Yu-Hao Chen and lei shi
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Zhejiang University of Technology
Downloads 3

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17.

Static magnetic field regulated interfacial reaction and strengthening mechanism of SAC305-xNi lead-free solder joints

Number of pages: 22 Posted: 24 Jun 2026
Xiao-bin Zhang, liang zhang, Yu-Hao Chen, Hui Wang and Xin-nian Chen
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, affiliation not provided to SSRN and Xiamen University of Technology
Downloads 0

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Ni nanoparticles, static magnetic field, SAC305 solder, microstructure, IMC