Liang Zhang

Xiamen University of Technology

Xiamen

China

  • Xiamen University of Technology

SCHOLARLY PAPERS

15

DOWNLOADS

220

TOTAL CITATIONS

7

Scholarly Papers (15)

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1.

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Downloads 35 (982,882)

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 18 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 28 (1,089,175)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 11 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 7 (1,351,301)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

2.

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Downloads 15 (1,003,887)
Citation 3

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 17 Nov 2023
Xiao Lu, Liang Zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan-Jiang Wu, xi huang and Kai Deng
Jiangsu Normal University, Xiamen University of Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen Institute of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 15 (1,260,235)
Citation 3

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(111) nt-Cu, Vacuum soldering, Reliability, EBSD

3.

Thermal, Microstructural, Wettability and Mechanical Properties of Sn1.0ag0.5cu Composite Solder Modified with Ti Nanoparticles

Number of pages: 19 Posted: 16 Jan 2024
Chuan Jiang Wu, Liang Zhang, Chen Chen and Xiao Lu
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University and Jiangsu Normal University
Downloads 24 (1,107,051)

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SAC105, Ti NPs, CTE, EPMA

4.

Intermetallic Compound Growth Behavior and Mechanical Performance in Sn58bi/Cu Solder Joint Bearing Mg Particles Incorporation During Thermal Aging

Number of pages: 22 Posted: 01 Dec 2023
xi huang, Liang Zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University
Downloads 23 (1,119,489)
Citation 1

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IMC growth, Sn58Bi solder, Mg particles, thermal aging, mechanical properties.

5.

Interfacial Reaction and Strengthening Mechanism of Thermo-Compression Bonding Foam Ni Reinforced Sac105 and Sac105-0.3ti Solder Joints

Number of pages: 21 Posted: 07 May 2024
Chuan Jiang Wu, Liang Zhang, Lei Sun, Peipei Huang and Xing-yu Guo
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Xiamen University of Technology and Xiamen University of Technology
Downloads 19 (1,169,087)

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SAC105, Ti NPs, Foam Ni, Thermo-compression bonding

6.

Microstructure Evolution and Thermal, Wetting, Mechanical Properties of Sic Nanowires Reinforced Sac105 Composite Solder

Number of pages: 18 Posted: 19 Nov 2022
Xiao Lu, Liang Zhang, Yong-huan Guo, Xi Wang, Li-li Gao, Li-Li Gao, Meng Zhao and Chen Chen
Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN and Jiangsu Normal University
Downloads 13 (1,240,928)

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low-Ag solders, nanowires, microstructure, agglomeration

7.

Investigating the Impact of Cobalt Incorporation on the Transformation of Cu6sn5 Layer to (Cu, Co)6sn5: Microstructural and Mechanical Insights

Number of pages: 25 Posted: 26 Mar 2024
xi huang, Liang Zhang, Kai Deng and Lei Sun
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Changzhou University
Downloads 12 (1,251,875)

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Co particles, Sn58Bi solder, IMC, microalloying, mechanical properties

8.

Formation and Growth Mechanism of Nano-Thin Cu 6 Sn 5  Films In Sn/Cu and Sn-0.1aln/Cu Structures Using Laser Heating

Number of pages: 11 Posted: 16 Feb 2024
Liang Zhang, Li-li Gao, Meng Zhao, W. M. Long, Li-li Gao, X. J. Lu and Xi Wang
Xiamen University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Jiangsu Normal University, Xiamen University of Technology and Jiangsu Normal University
Downloads 12 (1,251,875)

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laser heating, heating power, heating time, solder joints.

9.

Interfacial Reaction of Cu/Sac105/Cu Solder Joints Reinforced with Ti Nanoparticles Under Vacuum Thermo-Compression Bonding

Number of pages: 20 Posted: 19 Dec 2023
Chuan Jiang Wu, Liang Zhang, Lei Sun, Xiao Lu and Chen Chen
Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Jiangsu Normal University and Jiangsu Normal University
Downloads 12 (1,251,875)

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SAC105, Thermo-compression bonding, Shear strength

10.

Effect of Si3n4 Nanoparticles on Imc as Well as Mechanical Properties of Sn58bi/Cu Solder Joints During Thermal Aging

Number of pages: 10 Posted: 02 Apr 2024
Kai Deng, Liang Zhang, Mo Chen and Peipei Huang
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 11 (1,262,465)

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intermetallic compounds, thermal aging, Mechanical properties, Sn58Bi solder, Si3N4 nanoparticles

11.

Magnetic Field Accelerates Precipitation Kinetics of Magnetic Sn58bi-Ni Solder to Enhance the Strength of Solder Joint

Number of pages: 22 Posted: 27 Mar 2025
Liang Zhang, Chuan Jiang Wu, Yu-Hao Chen, Xin-Quan Yu, Quan-Bin Lu and Weimin Long
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and affiliation not provided to SSRN
Downloads 10 (1,272,500)

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magnetic solder, magnetic field, precipitation kinetics, first-principles

12.

Effect of Doping Si3n4 Nanoparticles on the Properties and Microstructure of Sn1.0ag0.5cu Solder

Number of pages: 15 Posted: 24 Sep 2024
Mo Chen, Liang Zhang, yu-ao Chen, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 10 (1,272,500)

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Sn1.0Ag0.5Cu solder, Si3N4 nanoparticles, IMC, microstructure, mechanical properties

13.

Study on the Interfacial Evolution and Mechanical Properties of the Cu/Sac105/Cu Solder Joint Modified by Si3n4 Nanowires

Number of pages: 15 Posted: 25 May 2023
Xiao Lu, Liang Zhang, Chen Chen and Xi Wang
Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University and Jiangsu Normal University
Downloads 9 (1,281,682)

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Si3N4 nanowires, interfacial reaction, mechanical strength, 3D packing

14.

Enhancement of Sac105 Solder for Vacuum Soldering with Cu Substrates Through Incorporation of Activated Ti Nanoparticles

Number of pages: 21 Posted: 24 Oct 2023
Chuan Jiang Wu, Liang Zhang, Chen Chen, Xiao Lu, Kai Deng and xi huang
Xiamen University of Technology, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Xiamen University of Technology and Xiamen University of Technology
Downloads 8 (1,290,109)
Citation 3

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Vacuum soldering, Mechanical properties, Fracture path, Agglomeration

15.

Shear Properties of Low-Temperature Soldered Joints of Aluminum Nitride Metallized with Sn-1.0ag-0.5cu-Ti Alloys

Number of pages: 20 Posted: 16 Oct 2024
Chuan Jiang Wu, Liang Zhang, Si-yong Gu, N. Jang, Hyoung Seop Kim and yu-ao Chen
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Harbin Institute of Technology, Pohang University of Science and Technology (POSTECH) - Department of Materials Science and Engineering and Xiamen University of Technology
Downloads 7 (1,297,821)

Abstract:

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Wettability, Pre-metallization, AlN, Interfacial microstructure, Shear strength