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Xin-Quan Yu

Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.

SCHOLARLY PAPERS

3

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112

TOTAL CITATIONS

1

Scholarly Papers (3)

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1.

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

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Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 18 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 56 (1,027,773)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

Ni Mesh-Reinforced Ultrasonic-Assisted Cu/Sn58bi/Cu Joint Performance: Experiments and First-Principles Calculations

Number of pages: 23 Posted: 11 Sep 2024
Xi Huang, Liang Zhang, Yu-Hao Chen, Lei Sun, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Changzhou University, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 13 (1,579,999)

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Ni mesh, Sn58Bi solder, Ultrasonic-assisted soldering, First-principles calculations

2.

Magnetic Field Accelerates Precipitation Kinetics of Magnetic Sn58bi-Ni Solder to Enhance the Strength of Solder Joint

Number of pages: 22 Posted: 27 Mar 2025
Liang Zhang, Chuan Jiang Wu, Yu-Hao Chen, Xin-Quan Yu, Quan-Bin Lu and Weimin Long
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and affiliation not provided to SSRN
Downloads 23 (1,411,822)

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magnetic solder, magnetic field, precipitation kinetics, first-principles

3.

Effect of Doping Si3n4 Nanoparticles on the Properties and Microstructure of Sn1.0ag0.5cu Solder

Number of pages: 15 Posted: 24 Sep 2024
Mo Chen, Liang Zhang, yu-ao Chen, Xin-Quan Yu and Quan-Bin Lu
Xiamen University of Technology, Xiamen University of Technology, Xiamen University of Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. and Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
Downloads 20 (1,459,862)
Citation 1

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Sn1.0Ag0.5Cu solder, Si3N4 nanoparticles, IMC, microstructure, mechanical properties