liang zhang

Jiangsu Normal University

101 Shanghai Rd

Tongshan

Xuzhou

China

  • Jiangsu Normal University

SCHOLARLY PAPERS

9

DOWNLOADS

197

TOTAL CITATIONS
Rank 44,637

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Top 44,637

in Total Papers Citations

15

Scholarly Papers (9)

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1.

Orthogonal Design Optimization for Cu/Sn58bi-0.4mg/Cu Solder Joint Strength in Ultrasonic-Assisted Soldering

Number of pages: 16 Posted: 20 Oct 2023
xi huang, liang zhang, min jia Zhang, Chen Chen, Xiao Lu and lei Sun
Xiamen University of Technology, Jiangsu Normal University, Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University and Changzhou University
Downloads 44 (901,644)

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ultrasonic-assisted soldering, Sn58Bi solder, Mg particles, orthogonal experiment, ANOVA.

2.

Interfacial Structures and Mechanical Properties of Cu/Sn/Cu Containing Sic Nanowires Under Transient Liquid Phase Bonding

Number of pages: 14 Posted: 07 May 2022
Mu-lan Li, liang zhang, Li-li Gao, Xi Wang, Chen Chen and Xiao Lu
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University
Downloads 35 (988,303)
Citation 8

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TLP bonding, IMC, mechanical performance, SiC NWs, Sn solder

3.

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Downloads 18 (1,009,245)

Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering

Number of pages: 14 Posted: 07 Nov 2023
Xiao Lu, liang zhang, Zhi-Quan Liu, Li-Yin Gao, Chen Chen, Chuan Jiang Wu, xi huang and Kai Deng
Jiangsu Normal University, Jiangsu Normal University, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences (CAS) - Shenzhen Institute of Advanced Technology, Jiangsu Normal University, Xiamen University of Technology, Xiamen University of Technology and Xiamen University of Technology
Downloads 18 (1,225,981)

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(111) nt-Cu, Vacuum soldering, Reliability, EBSD

4.

Growth Behavior and Reliability of Interfacial Imc for Sn58bi/Cu and Sn58bi-Aln/Cu Solder Joints Applied in Igbt Modules

Number of pages: 24 Posted: 29 Jul 2022
Xi Wang, liang zhang, Xiao Wang, Yong-huan Guo, Lei Sun, Ying-xia Liu, Chen Chen and Xiao Lu
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University, Changzhou University, affiliation not provided to SSRN, Jiangsu Normal University and Jiangsu Normal University
Downloads 32 (1,020,007)
Citation 5

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Sn58Bi, IMC, AlN nanoparticles, phase field simulation

5.

Formation and Growth Mechanism of Nano-Thin Cu6sn5 Films in Sn/Cu and Sn-0.1aln/Cu Structures Using Laser Heating

Number of pages: 11 Posted: 03 Mar 2023
liang zhang, Li-li Gao, Meng Zhao, W. M. Long, Li-li Gao, X. J. Lu and Xi Wang
Jiangsu Normal University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Jiangsu Normal University, Xiamen University of Technology and Jiangsu Normal University
Downloads 23 (1,125,319)

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intermetallic compounds, laser soldering, nano-Cu6Sn5 films, laser power

6.

Effect of Aln on the Microstructure Evolution of Cu/Sn58bi/Cu Solder Joints for 3d Packaging at Different Bonding Timeseffect of Aln on the Microstructure Evolution of Cu/Sn58bi/Cu Solder Joints for 3d Packaging at Different Bonding Times

Number of pages: 11 Posted: 29 May 2023
Xi Wang, liang zhang, Chen Chen and Xiao Lu
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University
Downloads 18 (1,187,026)

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TLP, Sn58Bi, solder joint, AlN nanoparticles

7.

Effect of Si3n4 Nanowires on the Interfacial Evolution and Mechanical Properties of the Cu/Sac105/Cu Solder Joint by Transient Liquid Phase Bonding

Number of pages: 15 Posted: 15 May 2023
Xiao Lu, liang zhang, Chen Chen and Xi Wang
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University
Downloads 11 (1,268,272)

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Si3N4 nanowires, interfacial reaction, mechanical strength, 3D packing

8.

Comprehensive Analysis of Sn58bi/Cu Solder Joints Reinforced with Mg Particles:  Wettability, Thermal, Mechanics, and Microstructural Characterization

Number of pages: 20 Posted: 09 Aug 2023
xi huang, liang zhang, Chen Chen, Xiao Lu and Xi Wang
Xiamen University of Technology, Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University
Downloads 9 (1,287,473)
Citation 2

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wettability, thermal properties, microstructure, interfacial IMC, mechanical properties

9.

Microstructure and Orientation Evolution of Β-Sn and Interfacial Cu6sn5 Imc Grains in Sac105 Solder Joints Modified by Si3n4 Nanowires

Number of pages: 19 Posted: 19 Jul 2023
Xiao Lu, liang zhang, Chen Chen and Xi Wang
Jiangsu Normal University, Jiangsu Normal University, Jiangsu Normal University and Jiangsu Normal University
Downloads 7 (1,303,562)

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CTE, Si3N4 nanowires, EBSD, grain orientation