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Kok Hwa Yu

Universiti Sains Malaysia (USM)

Minden, 11800

Malaysia

  • Universiti Sains Malaysia (USM)

SCHOLARLY PAPERS

2

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218

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0

Scholarly Papers (2)

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1.

Thermal Stress and Warpage Analysis in Silicon Wafers: Bridging Experimental and Computational Insights for Advanced Semiconductor Packaging

Number of pages: 28 Posted: 13 Jun 2025
krishnamoorthy Ramalingam, M.Z. Abdullah, Mohamad Aizat Abas, Kok Hwa Yu, R. Kamarudin, M. R. Abdul Rahman, S. F. Wong, P. K. Lam and B. E. Cheah
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Universiti Sains Malaysia (USM), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 158 (472,207)

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warpagesemiconductor inspectionelectronics packagingthermal effects

2.

Thermal Performance Optimization for a Tapered Heat Sink Using Definitive Screening Design

Number of pages: 30 Posted: 18 Apr 2023
Mark Selvan, M.S. Abdul Aziz, Nurulakmal Mohd Sharif, H.P. Ong, C.Y. Khor, Kok Hwa Yu and Mohd Remy Rozaini Mohd Arif Zainol
affiliation not provided to SSRN, Universiti Sains Malaysia (USM), Universiti Sains Malaysia (USM), affiliation not provided to SSRN, affiliation not provided to SSRN, Universiti Sains Malaysia (USM) and Universiti Sains Malaysia (USM)
Downloads 60 (961,006)

Abstract:

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Computational Fluid Dynamics, Heat transfer, Heat sink, Optimization, Bus Duct Conductor