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P. K. Lam,

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Thermal Stress and Warpage Analysis in Silicon Wafers: Bridging Experimental and Computational Insights for Advanced Semiconductor Packaging

Number of pages: 28 Posted: 13 Jun 2025

krishnamoorthy Ramalingam, M.Z. Abdullah, Mohamad Aizat Abas, Kok Hwa Yu, R. Kamarudin, M. R. Abdul Rahman, S. F. Wong, P. K. Lam and B. E. Cheah

affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Universiti Sains Malaysia (USM), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN

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Thermal Stress and Warpage Analysis in Silicon Wafers: Bridging Experimental and Computational Insights for Advanced Semiconductor Packaging

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