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krishnamoorthy Ramalingam
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SCHOLARLY PAPERS
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Scholarly Papers (1)
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Thermal Stress and Warpage Analysis in Silicon Wafers: Bridging Experimental and Computational Insights for Advanced Semiconductor Packaging
Number of pages: 28
Posted: 13 Jun 2025
krishnamoorthy Ramalingam,
M.Z. Abdullah
,
Mohamad Aizat Abas
,
Kok Hwa Yu
,
R. Kamarudin
,
M. R. Abdul Rahman
,
S. F. Wong
,
P. K. Lam
and
B. E. Cheah
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,
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, Universiti Sains Malaysia (USM),
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Abstract:
warpagesemiconductor inspectionelectronics packagingthermal effects
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