default author photo

M.Z. Abdullah

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

DOWNLOADS

195

TOTAL CITATIONS

0

Scholarly Papers (2)

Actions:
Email selected abstracts
1.

Thermal Stress and Warpage Analysis in Silicon Wafers: Bridging Experimental and Computational Insights for Advanced Semiconductor Packaging

Number of pages: 28 Posted: 13 Jun 2025
krishnamoorthy Ramalingam, M.Z. Abdullah, Mohamad Aizat Abas, Kok Hwa Yu, R. Kamarudin, M. R. Abdul Rahman, S. F. Wong, P. K. Lam and B. E. Cheah
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Universiti Sains Malaysia (USM), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 158 (472,207)

Abstract:

Loading...

warpagesemiconductor inspectionelectronics packagingthermal effects

2.

Improve Photovoltaic Panel Cooling by Using Hybrid Zno/Al2o3 Nanofluids

Number of pages: 13 Posted: 11 Sep 2024
adnan hussein, Z.A. Shaalan and M.Z. Abdullah
Northern Technical University, Northern Technical University and affiliation not provided to SSRN
Downloads 37 (1,222,651)

Abstract:

Loading...

photovoltaic (PV), hybrid nanofluid, electrical efficiency, power