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Au-Sn Solders Applied in Transient Liquid Phase Bonding: Microstructure and Mechanical Behavior

27 Pages Posted: 14 Aug 2019 First Look: Accepted

See all articles by Chaowei Du

Chaowei Du

Max Planck Institute for Iron Research

Rafael Soeler

Max Planck Institute for Iron Research

Bernhard Völker

Max Planck Institute for Iron Research; RWTH Aachen University - Materials Chemistry

Kurt Matoy

Infineon Technologies Austria AG

Johannes Zechner

Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik

Gregor Langer

Infineon Technologies Austria AG

Michael Reisinger

Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik

Juraj Todt

University of Vienna - Erich Schmid Institute of Materials Science

Christoph Kirchlechner

Max Planck Institute for Iron Research

Gerhard Dehm

Max Planck Institute for Iron Research

Abstract

Transient liquid phase bonding offers one option to generate a robust lead-free die attach with sound thermal and electrical conductivity in microelectronic packages. However, it remains a challenge to characterize the microstructure of the bonding layer because of its ultra-thin thickness and its nano-sized constituents. In this work, we characterized a Au-Sn soldering system of transient liquid phase bonding process in detail using various advanced techniques which successfully identified the nano-constituents and mapped their distribution in the sub-layers. On top of that, the mechanical behavior of the bonding layer has been investigated by micro-cantilever bending testing.

Keywords: Au-Sn solder, micro-cantilever testing, micro-bending, fracture toughness

Suggested Citation

Du, Chaowei and Soeler, Rafael and Völker, Bernhard and Matoy, Kurt and Zechner, Johannes and Langer, Gregor and Reisinger, Michael and Todt, Juraj and Kirchlechner, Christoph and Dehm, Gerhard, Au-Sn Solders Applied in Transient Liquid Phase Bonding: Microstructure and Mechanical Behavior. Available at SSRN: https://ssrn.com/abstract=3435688

Chaowei Du (Contact Author)

Max Planck Institute for Iron Research ( email )

Max-Planck-Straße 1
40237 Düsseldorf
Germany

Rafael Soeler

Max Planck Institute for Iron Research

Max-Planck-Straße 1
40237 Düsseldorf
Germany

Bernhard Völker

Max Planck Institute for Iron Research

Max-Planck-Straße 1
40237 Düsseldorf
Germany

RWTH Aachen University - Materials Chemistry

Germany

Kurt Matoy

Infineon Technologies Austria AG

Austria

Johannes Zechner

Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik

Austria

Gregor Langer

Infineon Technologies Austria AG

Austria

Michael Reisinger

Infineon Technologies Austria AG - Kompetenzzentrum Automobil- und Industrieelektronik

Austria

Juraj Todt

University of Vienna - Erich Schmid Institute of Materials Science

Jahnstraße 12
Leoben
Austria

Christoph Kirchlechner

Max Planck Institute for Iron Research

Max-Planck-Straße 1
40237 Düsseldorf
Germany

Gerhard Dehm

Max Planck Institute for Iron Research

Max-Planck-Straße 1
40237 Düsseldorf
Germany

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