Beijing, 100124
China
Beijing University of Technology - Faculty of Materials and Manufacturing
spent LiB recovery, life cycle assessment, pyrometallurgical recovery process, hydrometallurgical recovery process, multi-scenario simulation
Thermoelectric properties, Cu2S, Hydrothermal method, Ag nanoparticle
Keywords: Thermoelectric properties, Micro/nano structure, Cu2-xS, Hydrothermal method
Sn-3.5Ag, Nickel-Coated Carbon Fiber, Composite Solder, Isothermal Aging, Intermetallic Compound
Interconnect materials, Sintering, Micro/nano-hybrid structure particles, power electronic packaging
Thermoelectric materials, Ag nanoparticles, Cu2-xS, Hydrothermal synthesized, Nanopores
Cu-Sn intermetallic compounds, power electronic packaging, pulsed laser deposition, bonding mechanism
Under Bump Metallization, Cobalt-Phosphorus Film, Solid-State Diffusion, Intermetallic Compound, Rate-Controlling Process
Dual-beam pulsed laser deposition, Ag-Cu nanoparticle film, Power electronic packaging, Sintering, Low-temperature bonding
α-Al2O3, multilayer core-shell ceramic particle, Fe-based composite coatings, Laser cladding, Mechanical properties;
Cobalt‐phosphorus coatings, Solid-state diffusion, Diffusion barrier, Interfacial bonding, First-principles calculations
Sn-3.0Ag-0.5Cu, Indium content, Cooling rates, Cyclic Twin, Nucleus and growth
WPCBs; recovery; copper; electrolysis