Limin Ma

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

  • Beijing University of Technology

SCHOLARLY PAPERS

5

DOWNLOADS

171

TOTAL CITATIONS

2

Scholarly Papers (5)

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1.

Facilely Synthesized Ag Nanoparticles Coated Cu Microparticle Interconnect Material for Bonding Bare Cu in the Air at Low Temperature

Number of pages: 28 Posted: 07 May 2022
Zhou Wei, Zhihao Ji, Ziwei Yue, Xiaoliang Ji, Zhidong Xia, Jin Han, Limin Ma and Fu Guo
Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 50 (852,611)

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Interconnect materials, Sintering, Micro/nano-hybrid structure particles, power electronic packaging

2.

The Evolution of Compounds Growth between Sn-3.5Ag and Co-P Films with Different Phosphorous Contents

Number of pages: 43 Posted: 30 Dec 2021
Shuang Liu, Limin Ma, Yishu Wang, Cheng Zhen, Dan Li and Fu Guo
Beijing University of Technology, Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 38 (960,165)

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Under Bump Metallization, Cobalt-Phosphorus Film, Solid-State Diffusion, Intermetallic Compound, Rate-Controlling Process

3.

Facile Synthesis of Cu-Sn Nanoparticle Film and its Bonding Mechanism for Power Electronic Packaging

Number of pages: 22 Posted: 07 Nov 2023
Huan Hu, Qiang Jia, Yishu Wang, Bolong Zhou, Hongqiang Zhang, Mingan Zhang, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 36 (980,227)
Citation 1

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Cu-Sn intermetallic compounds, power electronic packaging, pulsed laser deposition, bonding mechanism

4.

Preparation of Ag-Cu Nanoparticle Film Using a Dual-Beam Pulsed Laser Deposition for Power Electronic Packaging

Number of pages: 22 Posted: 14 Nov 2023
Bolong Zhou, Qiang Jia, Yishu Wang, Dan Li, Hongqiang Zhang, Huan Hu, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 34 (1,000,938)
Citation 1

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Dual-beam pulsed laser deposition, Ag-Cu nanoparticle film, Power electronic packaging, Sintering, Low-temperature bonding

5.

Optimal Thickness of Nanocrystalline Cobalt-Phosphorus Coating with Good Diffusion Barrier and Small Space Requirement for Solder Joints

Number of pages: 45 Posted: 14 Dec 2024
Yuwei Wang, Shuang Liu, Limin Ma, Cheng Zhen, Jiaojiao Wang and Fu Guo
Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Nanyang Technological University (NTU) - School of Materials Science and Engineering and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 13 (1,249,364)

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Cobalt‐phosphorus coatings, Solid-state diffusion, Diffusion barrier, Interfacial bonding, First-principles calculations