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Hongqiang Zhang

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

5

DOWNLOADS

258

TOTAL CITATIONS

4

Scholarly Papers (5)

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1.

Rapid and Low Temperature Sintering Bonding Using Cu Nanoparticle Film for Power Electronic Packaging

Number of pages: 18 Posted: 18 Jun 2022
Yongchao Wu, Guisheng Zou, Shuaiqi Wang, Wei Guo, Hongqiang Zhang, Peng Peng, Bin Feng and Lei Liu
affiliation not provided to SSRN, Tsinghua University, Tsinghua University, Tsinghua University, affiliation not provided to SSRN, University of Waterloo, Tsinghua University and Tsinghua University
Downloads 90 (747,755)
Citation 2

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Pulsed laser deposition, Copper nanoparticles film, Die-attachment, sintering, shear strength

2.

Facile Synthesis of Cu-Sn Nanoparticle Film and its Bonding Mechanism for Power Electronic Packaging

Number of pages: 22 Posted: 07 Nov 2023
Huan Hu, Qiang Jia, Yishu Wang, Bolong Zhou, Hongqiang Zhang, Mingan Zhang, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 49 (1,074,648)
Citation 1

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Cu-Sn intermetallic compounds, power electronic packaging, pulsed laser deposition, bonding mechanism

3.

Preparation of Ag-Cu Nanoparticle Film Using a Dual-Beam Pulsed Laser Deposition for Power Electronic Packaging

Number of pages: 22 Posted: 14 Nov 2023
Bolong Zhou, Qiang Jia, Yishu Wang, Dan Li, Hongqiang Zhang, Huan Hu, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 44 (1,133,231)
Citation 1

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Dual-beam pulsed laser deposition, Ag-Cu nanoparticle film, Power electronic packaging, Sintering, Low-temperature bonding

4.

Laser Shock Induced Microstructure Strengthening Evolution and Phase Transformation of Titanium Alloy

Number of pages: 23 Posted: 19 Apr 2025
Jiaxin Shi, Wei Guo, Yongxin Zhang, Cheng Zhang, Junliang Xue, Guanda Qu, Bin Wang and Hongqiang Zhang
affiliation not provided to SSRN, Tsinghua University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 39 (1,209,354)

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Laser shock peening, Ti-6Al-4V, microstructure evolution, Phase transformation

5.

Free-Standing Silver Nanobelt Foils for Sintering Die Bonding of Power Electronics and its Power Cycle Reliability

Number of pages: 24 Posted: 30 Jul 2024
Xinda Wang, Rui Li, Yanli Xu, Wei Guo, Zilong Peng, Erping Deng and Hongqiang Zhang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Tsinghua University, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 36 (1,236,159)

Abstract:

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Silver nanobelts, Sintering, Shear strength, Thermal conductivity, Reliability