100 Ping Le Yuan
Chaoyang District
Beijing, 100020
China
Beijing University of Technology
Under Bump Metallization, Cobalt-Phosphorus Film, Solid-State Diffusion, Intermetallic Compound, Rate-Controlling Process
Dual-beam pulsed laser deposition, Ag-Cu nanoparticle film, Power electronic packaging, Sintering, Low-temperature bonding