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Qiang Jia

Beijing University of Technology - Faculty of Materials and Manufacturing

Beijing, 100124

China

  • Beijing University of Technology - Faculty of Materials and Manufacturing

SCHOLARLY PAPERS

4

DOWNLOADS

207

TOTAL CITATIONS

5

Scholarly Papers (4)

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1.

Stabilized Interfacial Intermetallic Compound Evolution in Ni-Coated Carbon Fiber Reinforced Sn-3.5Ag Composite Solder Joint

Number of pages: 20 Posted: 23 Dec 2021
Yihui Du, Yishu Wang, Xiaoliang Ji, Qiang Jia, Fuwen Zhang and Fu Guo
Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology - Faculty of Materials and Manufacturing, General Research Institute for Nonferrous Metals and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 61 (951,658)

Abstract:

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Sn-3.5Ag, Nickel-Coated Carbon Fiber, Composite Solder, Isothermal Aging, Intermetallic Compound

2.

Temperature Dependence of the Tensile and Thermal Fatigue Cracking Properties of Laser-Deposited Cobalt-Based Coatings for Brake Disc Application

Number of pages: 40 Posted: 01 Aug 2022
Ying Wu, Guisheng Zou, Yan Liu, Zhanwen A, Wenzheng Zhao, Wengan Wang, Junliang Xue, Yongxin Zhang, Qiang Jia and Hui Chen
Southwest Jiaotong University, Tsinghua University, Southwest Jiaotong University, Tsinghua University, Tsinghua University, Tsinghua University, affiliation not provided to SSRN, affiliation not provided to SSRN, Beijing University of Technology - Faculty of Materials and Manufacturing and Southwest Jiaotong University
Downloads 53 (1,031,043)
Citation 3

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cobalt-based coating, Mechanical properties, thermal fatigue crack propagation, martensitic transformation

3.

Facile Synthesis of Cu-Sn Nanoparticle Film and its Bonding Mechanism for Power Electronic Packaging

Number of pages: 22 Posted: 07 Nov 2023
Huan Hu, Qiang Jia, Yishu Wang, Bolong Zhou, Hongqiang Zhang, Mingan Zhang, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 49 (1,074,648)
Citation 1

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Cu-Sn intermetallic compounds, power electronic packaging, pulsed laser deposition, bonding mechanism

4.

Preparation of Ag-Cu Nanoparticle Film Using a Dual-Beam Pulsed Laser Deposition for Power Electronic Packaging

Number of pages: 22 Posted: 14 Nov 2023
Bolong Zhou, Qiang Jia, Yishu Wang, Dan Li, Hongqiang Zhang, Huan Hu, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 44 (1,133,231)
Citation 1

Abstract:

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Dual-beam pulsed laser deposition, Ag-Cu nanoparticle film, Power electronic packaging, Sintering, Low-temperature bonding