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Huan Hu

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

  • Beijing University of Technology

SCHOLARLY PAPERS

2

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2

Scholarly Papers (2)

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1.

Facile Synthesis of Cu-Sn Nanoparticle Film and its Bonding Mechanism for Power Electronic Packaging

Number of pages: 22 Posted: 07 Nov 2023
Huan Hu, Qiang Jia, Yishu Wang, Bolong Zhou, Hongqiang Zhang, Mingan Zhang, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 50 (1,074,648)
Citation 1

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Cu-Sn intermetallic compounds, power electronic packaging, pulsed laser deposition, bonding mechanism

2.

Preparation of Ag-Cu Nanoparticle Film Using a Dual-Beam Pulsed Laser Deposition for Power Electronic Packaging

Number of pages: 22 Posted: 14 Nov 2023
Bolong Zhou, Qiang Jia, Yishu Wang, Dan Li, Hongqiang Zhang, Huan Hu, Limin Ma, Guisheng Zou and Fu Guo
Beijing University of Technology, Beijing University of Technology - Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing University of Technology, affiliation not provided to SSRN, Beijing University of Technology, Beijing University of Technology, Tsinghua University and Beijing University of Technology - Faculty of Materials and Manufacturing
Downloads 44 (1,133,231)
Citation 1

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Dual-beam pulsed laser deposition, Ag-Cu nanoparticle film, Power electronic packaging, Sintering, Low-temperature bonding